Odisha to Host India's First Advanced 3D Semiconductor Chip Packaging Unit

Odisha's Tech Leap: India’s First 3D Chip Stacking Facility

In a historic move for India's electronics mission, Odisha will host the ground-breaking of the nation’s first Advanced 3D semiconductor chip packaging unit in Bhubaneswar. This facility marks India's entry into high-end 3D heterogeneous integration technology.

Technical Innovations

• Glass Substrate: The unit utilizes glass substrate-based technology, which offers superior thermal and electrical properties compared to traditional substrates.

• 3D Stacking: It introduces 3D heterogeneous integration, allowing for higher processing power in smaller chip footprints.

• State Achievement: Odisha becomes the first state in India to house both semiconductor fabrication (fab) and advanced packaging ecosystems.

For IT and Tech aspirants, this is a vital update under 'Make in India' and 'Semiconductor Mission,' positioning Odisha as a new global tech hub.